SPECIFICHE TECNICHE
Printing TechnologyFused Filament Fabrication (FFF)
Build Volume610 x 508 x 508 mm
Build PlatformVacuum System
LevelingAutomatic Leveling
Layer Thickness0.05-0.5mm
Printing SpeedXY: Max. 500mm/s Z: Max. 300mm/s
Printing Nozzles2 Printing Nozzles Without Scratching
Extruder TemperatureMax. 500°C
Platform TemperatureMax. 300°C
Chamber TemperatureMax. 300°C
Filament Chamber TemperatureMax. 70°C
Input File TypeSTL, OBJ
Filament Diameter1.75mm/2.85mm
Position ResolutionXY: 12µm Z: 7µm
Motor DriveHigh Precision Servo System
Smart Monitor & controlAuto-cleaning Nozzles, Filament Jam Warning, Filament Absence Warning, Power Failure Recovery, Water and Active Air Cooling, Over Heat Protection
Safety CertificationFCC and CE
ConnectivityWiFi, Internet, USB
Supported MaterialsPEEK, PEEK+CF, PEKK, ULTEM (PEI), PPSU, PC, PC Alloys, PA, PA+CF, ABS, Carbon Fiber-Filled, Metal-Filled, Fiberglass-Filled, ASA, PETG, ESD-Safe, HIPS, TPU, PLA, PVA, etc.
Recensioni
Ancora non ci sono recensioni.