SPECIFICHE TECNICHE
Printing TechnologyFused Filament Fabrication (FFF)
Build Volume305 x 305 x 406 mm
Build PlatformPI Sheet Heating + Ceramic Glass
LevelingAutomatic Leveling
Layer Thickness0.05-0.5mm
Printing SpeedMax. 300mm/s
Printing Nozzles2 Printing Nozzles Without Scratching
Extruder TemperatureMax. 500°C
Platform TemperatureMax. 160°C
Chamber TemperatureMax. 90°C
Filament Chamber TemperatureMax. 70°C
Input File TypeSTL, OBJ
Filament Diameter1.75mm
Position ResolutionXY: 16µm Z: 1.6 µm
Smart Monitor & controlFilament Jam Warning, Filament Absence Warning, Power Failure Recovery
Safety CertificationFCC and CE
ConnectivityWiFi, Internet, USB
Supported MaterialsPEEK, PEEK+CF, PEKK, ULTEM (PEI), PPSU, PC, PC Alloys, PA, PA+CF, ABS, Carbon Fiber-Filled, Metal-Filled, Fiberglass-Filled, ASA, PETG, ESD-Safe, HIPS, TPU, PLA, PVA, etc.
Recensioni
Ancora non ci sono recensioni.